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600Ω Common Mode Inductor for Data Lines
600Ω Common Mode Inductor for Data Lines
600Ω Common Mode Inductor for Data Lines

600Ω Common Mode Inductor for Data Lines

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Product Attributes

Model No.3225

Installation MethodSurface Mount

Working Temperature-40℃~+85℃

EncapsulationSOP

Resistance Error±20%

Temperature Coefficient25℃

Impedance600Ω

Frequency - Self-resonance100MHz

Height - Installation (Max)1.4mm

Packaging/HousingSurface Mount Inductor

SizeH80D I 3.20X2.50X0.65-A

Thickness1.2±0.20

Number Of Coils2UEW-φ0.035X1PX9TS

Material - Magnetic CoreH80D

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Product Description

Designed to meet the stringent demands of modern high-density circuit boards, this compact surface mount Inductor functions as a high-performance Common Mode Choke optimized for EMI control in fast-paced digital environments. Measuring just 3.20mm × 2.50mm with a body height of only 0.65mm and a maximum installed height of 1.4mm, it delivers exceptional space efficiency without sacrificing filtering capability—making it ideal for ultra-slim consumer electronics such as smartphones, smartwatches, wireless earbuds, tablets, and compact IoT edge devices where every millimeter counts.

With a nominal impedance of 600Ω and a self-resonant frequency of 100MHz, this component effectively suppresses high-frequency common-mode noise that commonly arises from switching regulators, clock signals, and high-speed serial interfaces like USB, HDMI, MIPI, and Ethernet. Its dual-coil structure—wound with 2UEW-φ0.035 enameled copper wire in a precise 1P×9TS layout—ensures balanced inductance and symmetrical signal paths, which is critical for maintaining signal integrity while rejecting electromagnetic interference. Unlike general-purpose power Inductors used for energy storage, this device is engineered specifically for differential signal line protection, offering minimal insertion loss for desired data while attenuating disruptive noise.

The magnetic core is fabricated from H80D ferrite material, selected for its stable permeability, low hysteresis loss, and consistent performance across the full industrial operating temperature range of -40℃ to +85℃. This thermal resilience ensures reliable operation in both indoor consumer gadgets and more demanding settings such as automotive cabin electronics, industrial sensors, and outdoor communication modules. Encapsulated in a robust SOP (Small Outline Package) housing, the inductor is fully compatible with standard reflow soldering processes and automated pick-and-place assembly lines, supporting high-yield manufacturing at scale.

A thickness tolerance of 1.2±0.20mm guarantees uniform standoff height during PCB assembly, significantly reducing common production issues like tombstoning, misalignment, or inconsistent solder joints. The ±20% resistance tolerance reflects practical manufacturing variability while still meeting functional requirements in cost-sensitive yet performance-driven applications—striking an optimal balance between affordability and reliability for medium-to-high-volume production runs.

Among essential passive Electronic Components, this inductor addresses one of the most persistent challenges in modern PCB design: passing rigorous EMC compliance tests without redesigning entire layouts. By placing this Common Mode Choke close to I/O ports or near noise-generating ICs, engineers can dramatically reduce both conducted and radiated emissions. Best layout practices include using short, symmetrical traces for both windings and avoiding routing high-current or analog-sensitive lines beneath the component to prevent unwanted magnetic coupling.

Despite its miniature footprint—among the smallest in its class—this inductor maintains excellent saturation characteristics and stable impedance under typical DC bias conditions, ensuring long-term reliability in both power delivery networks and high-speed signal chains. For design teams developing compact, high-performance electronics that must meet global regulatory standards, this device represents a strategic choice within the broader portfolio of precision-engineered Inductors and mission-critical Electronic Components for next-generation EMI mitigation.

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