High-Density Modular Wire To Board Connector

Compact and versatile, this Wire To Board Connector is designed for high-density applications where space efficiency is critical. Its modular construction allows for flexible configurations, supporting 2 to 12 poles to accommodate various circuit designs. With a current rating of 1.0A AC/DC and voltage rating of 50V AC/DC, it delivers reliable performance for low-power electronic systems.

The connector is optimized for fine-pitch applications, compatible with AWG #32 to #28 wires, and fits PCBs with a thickness of 0.8mm. Its precise alignment and low contact resistance of ≤20mΩ ensure stable signal transmission, while an insulation resistance of ≥500MΩ guarantees safety and electrical isolation between circuits. Additionally, it can withstand voltages up to 500V AC per minute, making it suitable for sensitive electronic environments.

Engineered for durability, the housing is made from LCP UL 94 V-0, providing excellent heat resistance and flame retardancy. Phosphor-bronze tin-plated pins contribute to long-term reliability by resisting corrosion and maintaining consistent electrical contact. The base, constructed from Nylon 66 UL 94 V-0, further enhances mechanical stability, allowing the connector to withstand repeated insertions and removals without performance degradation.

Applications of this connector span across compact consumer electronics, communication devices, medical equipment, and precision instrumentation. Its pcb wire connector compatibility ensures seamless integration with board-level circuits, reducing assembly complexity. As a board level connector, it offers secure mounting and alignment on the PCB, minimizing the risk of accidental disconnections and improving system reliability.

Maintenance is simple: routine inspection of pin contacts and wire terminations helps sustain optimal functionality. The connector’s modular design allows for easy upgrades or replacements, enhancing the adaptability of electronic systems. Its low-profile form factor and high-density arrangement make it ideal for devices where PCB space is limited, without compromising connectivity integrity.

This high-density modular wire to board connector combines reliability, compactness, and electrical performance, providing a dependable solution for designers who require precise and robust connections in constrained electronic assemblies.

Specifications:

• Poles: 2 to 12P

• Current Rating: 1.0A AC/DC

• Voltage Rating: 50V AC/DC

• Temperature Range: -25℃ to +85℃

• Contact Resistance: ≤ 20mΩ

• Insulation Resistance: ≥ 500MΩ

• Withstand Voltage: 500V AC/minute

• Applicable Wire: AWG #32 to #28

• Applicable PC board thickness: 0.8mm

• Material: Housing: LCP UL 94 V-0; Pin: Phos.Bronze Tin-Plated; Base: Nylon 66 UL 94 V-0