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High-Current SMD Power Inductor with Dual Coils
High-Current SMD Power Inductor with Dual Coils
High-Current SMD Power Inductor with Dual Coils
High-Current SMD Power Inductor with Dual Coils

High-Current SMD Power Inductor with Dual Coils

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Product Attributes

Model No.7060/H20C DRS 7.40X6.00X3.80

Installation MethodSurface Mount

Working Temperature-40℃~+85℃

EncapsulationSOP

Temperature Coefficient25℃

Frequency - Self-resonance100KHz/0.1V

Height - Installation (Max)3.4mm

Inductor4.70±30%

Packaging/HousingSurface Mount Inductor

SizeH20C DRS 7.40X6.00X3.80

Thickness3.2±0.20

Number Of Coils2UEW-φ0.35X1PX7TS

Inductor - Parallel4.70±30%

Material - Magnetic CoreH20C

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Product Description

Engineered for demanding power conversion applications, this high-current surface mount power Inductor is a key member of the Inductors family, featuring a robust dual-coil design using 2UEW-φ0.35 wire wound in a precise 1P×7TS configuration. With an inductance rating of 4.70µH ±30%—both in standard and parallel configurations—it delivers stable energy storage and efficient filtering in DC-DC converters, voltage regulators, and switch-mode power supplies. The magnetic core is constructed from H20C ferrite material, selected for its high saturation flux density and low core losses at low operating frequencies, ensuring reliable performance even under heavy load conditions. As one of the most critical passive Electronic Components in power electronics, it enables efficient energy transfer while maintaining system stability.

Encapsulated in a durable SOP package, this inductor is designed for automated surface-mount assembly while maintaining excellent mechanical stability. Its compact footprint measures 7.40mm × 6.00mm with a height of 3.80mm, and a maximum installed height of 3.4mm makes it suitable for space-constrained yet power-intensive designs such as server motherboards, industrial motor drives, telecom power modules, and automotive electronics. The thickness tolerance of 3.2±0.20mm ensures consistent standoff and solder joint reliability during reflow processes, reducing the risk of warping or misalignment. Though not a Common Mode Choke—which targets EMI in signal lines—this power inductor fulfills a complementary role by stabilizing current flow and minimizing ripple in high-power circuits.

Operating reliably across an industrial temperature range of -40℃ to +85℃, this component maintains stable electrical characteristics in harsh environments. Its self-resonant frequency of 100kHz at 0.1V indicates optimized performance in low-frequency power applications where minimizing ripple current and stabilizing output voltage are critical. Unlike high-frequency signal Inductors or EMI-focused Common Mode Choke devices, this model prioritizes energy handling capacity and thermal resilience over ultra-high-speed response, making it ideal for bulk power filtering rather than RF or data-line noise suppression. This distinction underscores its specialized function among essential Electronic Components used in modern power architectures.

Designers often encounter challenges such as inductor saturation, audible coil whine, or thermal runaway in high-power circuits; this inductor addresses these issues through its high-permeability H20C core and balanced dual-winding structure, which reduces magnetic leakage and improves current-sharing efficiency. The ±30% inductance tolerance reflects practical manufacturing variability while still meeting functional requirements in non-precision power stages—common in cost-sensitive but performance-driven applications. While it does not serve as a Common Mode Choke, its ability to maintain clean power delivery indirectly supports overall electromagnetic compatibility in complex systems populated with diverse Electronic Components.

When integrating this inductor into PCB layouts, engineers should ensure adequate copper pour for thermal dissipation, avoid placing sensitive analog components nearby due to potential magnetic coupling, and maintain symmetrical trace routing for both windings to preserve balance. It is particularly effective in buck, boost, and buck-boost topologies where consistent inductance under DC bias is essential. Thanks to its surface-mount form factor, it eliminates the need for through-hole drilling, streamlining production and enhancing board-level reliability in high-vibration environments. This inductor represents a smart compromise between size, current handling, and cost—making it a go-to choice among power Inductors for modern electronics requiring dependable, compact energy storage solutions.

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