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High-Temperature Failure Troubleshooting Method

2026,01,09
High-temperature environments are a common cause of board-to-board connector failures, potentially leading to abnormal increases in contact resistance or accelerated thermal aging of materials. When troubleshooting such issues, temperature cycling tests should first be carried out to simulate temperature fluctuation ranges under actual operating conditions, while monitoring connector performance changes during mating and unmating.

By analyzing contact resistance curves and thermal stress distribution at elevated temperatures, failure points—such as terminal deformation or degradation of insulating materials—can be accurately identified. In addition, the use of infrared thermography enables visual detection of localized overheating areas, helping to pinpoint thermal concentration risks. At the same time, referring to industry standards such as JEDEC JESD22-A104 and conducting accelerated aging tests allows evaluation of long-term reliability and the development of targeted improvement measures.

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